ISSI Adds Chip Supply for Distribution of Die and Wafer-Level Products

SANTA CLARA, Calif., October 3, 2005 - Integrated Silicon Solution, Inc. (Nasdaq: ISSI), a leader in advanced memory solutions, today announced Chip Supply, Inc. as a newly franchised distributor of ISSI die and wafer-level products worldwide. Headquartered in Orlando, Florida, Chip Supply, Inc. is the world's largest distributor of die and wafer-level products.

"The demand for increased communications and data processing in ever smaller form factors, along with advances in multi-chip packaging technology, has increased the need for devices to be available in die form. We are excited to have an industry leader like Chip Supply join us as we expand our die and wafer-level business. Their extensive interconnect, test, and assembly services make them an important partner for ISSI in helping to provide multi-chip solutions to the industry," said Sanjiv Asthana, vice president of sales and marketing for ISSI.


"ISSI adds many SRAMS, DRAMs and EEPROMs to Chip Supply's product offering that are often difficult to source in the industry," said Tony Hamby, vice president of marketing and sales for Chip Supply.


About ISSI
ISSI is a fabless semiconductor company that designs and markets high performance integrated circuits for the following key markets: (i) digital consumer electronics, (ii) networking, (iii) mobile communications and (iv) automotive electronics. The Company's primary products are high speed and low power SRAM and low and medium density DRAM. The Company also designs and markets EEPROM, wireless chipsets, SmartCards and is developing selected non-memory products focused on its key markets. ISSI is headquartered in Silicon Valley with worldwide offices in China, Europe, Japan, Hong Kong, India, Korea and Taiwan. Visit our web site at www.issi.com

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About Chip Supply, Inc.

Chip Supply specializes in the supply of semiconductor die, value-added services and advanced electronic interconnect solutions. Among Chip Supply's products are bare die, bumped die and wafer, Known Good Die and custom packaging, including CSP. For more information contact Chip Supply directly at 407-298-7100 or visit their website at www.chipsupply.com.

Contact:
Integrated Silicon Solution, Inc.
Isabelle Silva 408.969.4660
isilva@issi.com

Tom Doczy 408.969.4620
tdoczy@issi.com

Hayes Marketing
Larry Hayes 408.871.0135
larrywhayes@sbcglobal.net

Chip Supply Quality Director Receives Industry Achievement Award

At the 11th annual KGD Packaging & Test Workshop in Napa, CA, the Die Products Consortium (DPC) presented the Industry Achievement Award to Mr. Jim Wolbert of Chip Supply, Inc. for his leadership in developing international standards for semiconductor die products. The DPC presents the award annually to an individual for exemplary contributions to enlarging the world-wide markets for die products.