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by making available the latest
semiconductor technologies in form factors
not readily available in the marketplace. From bare die to “near
die size”
packaging to hermetic encapsulation, Chip Supply provides
interconnect solutions
optimized to meet customer requirements. This is
Thinking Beyond
Silicon.
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- Micross Components Recognized for
Excellence by Raytheon Space and Airborne Systems
- Chip Supply Announces Integration
with Micross Components
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Chip
Supply's solution to
our customers packaging
and interconnect needs.
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