Die Products & Wafer Processing

Chip Supply’s foundation grew in our ability to buy and sell bare die and wafers. Working with all of the leading semiconductor manufacturers Chip Supply offers a broad range of technologies and has accessibility to thousands of part types.

Chip Supply has the in-house expertise to process wafers. We can dice, inspect and provide the singulated die in a carrier that best suits your production requirements. As a general rule of thumb Chip Supply performs a visual inspection in accordance with MIL-STD-883 Method 2010 Condition B on all material that we dice. We are not however limited to this criteria and can do custom inspections based on your requirements.

Chip Supply is also able to provide wafer backlapping and bumping services. Please refer to their detailed pages to get further information about design rules and minimum thicknesses available.