Wafer bumping is an advanced packaging technique that attaches solder spheres or gold bumps to the bond pads on a selected die. Gold bumping is generally used for Tape Automated Bond (TAB) assembly or Anisotropic Conductive Film (ACF) flip-chip assembly. Solder bumping is primarily used for reflow flip-chip assembly which unites the components face down, directly with the substrate or board through conductive bumps on the bond pads. These bumps deliver the electrical, mechanical and thermal interconnection which provides direct contact between the chip package and the device.

Another process is called stud-bumping. Unlike gold and solder bumping, this process can be done at the die level.

Wafer bumping also known as flip chip has traditionally been used for high-end niche applications. However in the last few years it has gone mainstream to include a wider range of consumer applications geared towards both the performance driven market and the form factor driven market.

To learn more about the bumping process, its advantages and disadvantages contact your local salesperson by calling (407)298-7100 and ask for sales.