Wafers and die can be sent out in various forms. Due to the delicate handling requirements of un-encapsulated die, the method of transport and carrier ensure the safety and quality of the devices delivered. Occasionally die are delivered to a customer's production line still mounted on the wafer tape where the customer's automatic die placement equipment picks off the die and places it on the circuit. Many times, the die are placed into a carrier prior to delivery. The most common form of carrier is the tray, commonly called "waffle pack" because of their appearance. Each tray has square or rectangular cavities in a matrix. There are endless sizes because the cavity has to be just slightly larger than the die in each direction, including the depth of the cavity. The idea is to hold the die as motionless as possible and maintain its alignment in the cavity for ease of removal; if it rattles around, bits of silicon will break off and can damage the sensitive top side of the die. It also has to be large enough that the die can be easily removed.

Other types of carriers are Gel Pak® and various forms of tape and reel. Gel Paks® hold the die by surface tension, so there is no possibility of die movement. While there is no cavity size to worry about, Gel Paks® should be selected with various sizes of mesh and surface tackiness depending on die size. Gel Paks® require the use of an inexpensive vacuum release tool to remove the die.
Both trays and Gel Paks® are available in 2" or 4" square sizes.

Tape and reel, of increasing interest to our customers, is available in a range of formats. Please call us to discuss your requirements.