Packaging Solutions

Chip Supply offers specialized interconnect solutions to customers looking for increased performance in a smaller space. We are capable of providing a full range of high-quality ceramic hermetic and QML package design, assembly, electrical test and environmental screening. In addition to single die packaging, Chip Supply also offers multi-die module assembly on ceramic and laminate substrates.

Chip Scale Packaging, which is considered the smallest possible package for a given die size, is presently offered by Chip Supply as a wire bond version on a BT substrate and in the future there will be a flip chip version as well. Wafer Level Chip Scale Packaging, which is small size and has reduced interconnect impedance, is performed on die at wafer level before they are singulated from the wafer.

Chip Supply currently supplies tape automated bond (TAB) in both JEDEC and reel-to-reel formats to the flat panel display and MCM markets. The key to TAB processing is that the circuit traces can be cantilevered over holes punched into the tape.