Hermetic Packaging /
QML
Chip Supply offers custom ceramic package design, assembly,
electrical test and environmental screening. This service is
primarily aimed at the high reliability, hermetic, single-die,
legacy packaging market.
We use the latest versions of AutoCAD and PADS software for package
and substrate design. Chip Supply can identify a suitable open
tooled package, or design a special package for unique
applications. We will also procure packages or substrates and any
discrete components such as capacitors as needed to fulfill your
packaging requirements.
Assembly
Chip Supply is a QML 38535 certified facility. We offer ceramic
hermetic packaging in LLCC, LCC, DIP, PGA, metal can and Flat pack
formats. Ceramic and laminate substrate packaging is offered in BGA
format. Available array pitches range from 0.5 mm to 1.27 mm.
- Die attach – JM7000, Eutectic, Epoxy, and Solder
- Wire Bond – Gold wire bonders - Wire sizes, (.7) mils to 2
mils
- Wire Bond – Aluminum wire bonders - Wire sizes, 1 mil to 3
mils
- Wire Bond – Wire sizes, 5 mils to 20 mils
- Seal – Parallel seam sealer, solder, can weld, epoxy
Environmental, mechanical and
electrical testing
- Fine and Gross leak testing
- Complete electrical testing at industrial and military
temperature ranges.
- Static and Dynamic burn-in
- Full Mil 883 Group testing (A, B, C, D)
If you have any questions or need information about how we can
help with your needs for a customized package, please contact us at
sales@chipsupply.com or
refer to our Chip Supply
Team page for assistance.
For More Information About
Chip Supply Click Here.
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