Multi Chip
Packaging
In addition to Chip Scale Packaging and ceramic single die
packaging, Chip Supply offers few-die module assembly on ceramic
and laminate substrates. The standard format is BGA with pitches
from .5 mm to 1.27 mm. Both ceramic and laminate assemblies can be
provided with die attach and wire bond or as flip chip and
underfill.
Electrical tests and
screening
- All die electrically probed prior to assembly.
- Known Good Die (KGD) processes available if financial
considerations warrant verifying die quality and reliability prior
to MCM assembly, and/or if acceptable individual die screening is
not possible at MCM level.
- Temperature modeling available
- Commercial, industrial and military temperature range
electrical testing.
- Static and dynamic burn-in.
- Environmental testing.
If you have a few devices that need to be made available in a
smaller form factor and would like to see what options you have to
make that possible, please contact us at sales@chipsupply.com or go to our
Chip Supply Team page
for assistance.
For More Information About
Chip Supply Click Here.
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