Failure analysis is a scientific method of determining the root cause of why a device(s) does not perform as expected. The device non-conformance can be from totally non-functional to slightly out of tolerance for a specified parameter. Our ability to draw upon years of semiconductor testing experience, close supplier relationships and an in house failure analysis lab enables Chip Supply to quickly respond when a non-conformance is detected.

The first steps involve reviewing historical data about the particular device and independently validating the non-conformance. At that point the initial non-invasive techniques are utilized such as hermetic testing, x-ray, CSAM and external visual inspection. Now that the outside condition of the device and minimal internal information has been gathered the engineer will have enough data to lead him in the proper direction for the next steps.

The next step involves decapsulation of the device either mechanically or chemically depending on the packaging technology. Visual inspection will yield information about the die attach, wire bonds and the bare die surface which will assist in ruling out mechanical / assembly related issues.

Having ruled out assembly and mechanical issues the die comes under scrutiny. The engineer might use liquid crystal to isolate the fault and / or micro probing. Based on knowledge of the failure a high magnification inspection in the SEM may be appropriate. While in the SEM an EDX analysis could be conducted to determine the presence of undesirable elements.

Once the nature of the failure mechanism is understood more investigation may be necessary to determine the root cause. Is it lot related, or just the single device? Once determined this information is used to acquire replacement material or provide assurances that the lot is acceptable.

Chip Supply has the experience, data, tools and supplier relationships in house to successfully diagnose most product related failures. This saves our customers valuable time and provides a level of confidence in our delivered products.

Chip Supply's FA Tool Box:

Fine and Gross Leak Equipment	Nemarsky Microscope
Stereo Zoom Microscope	Metallurgical Microscope
Curve Tracer	SEM w/EDX
Micro Probe Station	Cross-Sectioning Equipment
Liquid Crystal	CSAM
Photomicrograph Equipment