Chip Supply has demonstrated technical competency in the development of package and probe test solutions. From new product development to meeting customer's SCD test requirements, Chip Supply is able to provide a total test solution for the products we support.

Capabilities:

• new product development
• MIL standard testing
• design validation
• product up screening
• performance and parameter grading / categorizing
• 100% SCD test requirements
• product characterization
• MCM verification testing
• logic device erasure and programming
• element evaluation

Test Temperature Capabilities:

• Package test -55C to 200C
• Wafer probe -55C to 155C