Wafer Probe
 Wafer
probe is the simplest and most direct method of testing
un-encapsulated die. Most of the semiconductor manufacturers
provide wafers already probed to a set of DC parameters at room
temperature to guarantee that they meet a basic subset of the
package part specification. Today more and more of the
semiconductor manufacturers are only performing sample probe tests
on their wafers prior to package assembly. This is partially due to
improved processes at the fab level and yields at final test.
Wafer probe testing is required
for 4 reasons:
- Specification requires that the die are 100% probed.
- Identify devices with higher performance levels and segregate
them accordingly.
- Need to guarantee that the parts will perform to a certain
specification level.
- Select parameter testing or probing at temperature (hot or
cold).
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